Search results
504 results found
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LNP™ THERMOCOMP™ Compound EFB26ER
LNP THERMOCOMP EFB26ER compound is based on Polyetherimide (PEI) resin containing 30% glass fiber, 10% glass bead. Added features of this grade include: Easy Molding, Mold Release.
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LNP™ THERMOCOMP™ Compound EX11414
LNP THERMOCOMP EX11414 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, FAR25.853 Complia...
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LNP™ THERMOCOMP™ Compound EX00781H
LNP THERMOCOMP EX00781H is a compound is based on Polyetherimide (PEI) resin containing 20% glass fiber. Added features of this grade include: Healthcare.
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LNP™ THERMOCOMP™ Compound EX06430H
LNP THERMOCOMP EX06430H compound is based on Polyetherimide (PEI) resin containing mineral. Added features of this grade include: Healthcare, X-Ray Detectable.
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LNP™ THERMOCOMP™ Compound EF006
LNP THERMOCOMP EF006 compound is based on Polyetherimide (PEI) resin containing 30% glass fiber.
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LNP™ THERMOCOMP™ Compound EF006ER
LNP THERMOCOMP EF006ER compound is based on Polyetherimide (PEI) resin containing 30% glass fiber. Added features of this grade include: Easy Molding, Mold Release.
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LNP™ THERMOCOMP™ Compound EF006H
LNP THERMOCOMP EF006H compound is based on Polyetherimide (PEI) resin containing 30% glass fiber. Added features of this grade include: Healthcare.
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LNP™ THERMOCOMP™ Compound EF002EXH
LNP THERMOCOMP EF002EXH compound is based on Polyetherimide (PEI) resin containing 10% glass fiber. Added features of this grade include: Healthcare.
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LNP™ THERMOCOMP™ Compound EF004
LNP THERMOCOMP EF004 compound is based on Polyetherimide (PEI) resin containing 20% glass fiber.
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LNP™ THERMOCOMP™ Compound FF004
LNP THERMOCOMP FF004 is a compound based on Polyethylene (PE) resin containing 20% Glass Fiber.