A BIG STEP FORWARD IN MANUFACTURING SMALLER COMPONENTS

As electronic components shrink in both size and weight to support new generations of smaller, lighter and more-sophisticated mobile and wearable devices, there is a need for new materials that offer optimized performance in miniaturized configurations.

These materials are required for use in integrated circuit chips, onboard connectors, cassettes, IC process carriers, FOUPs and gas/liquid transport system components.

In response, SABIC, has introduced two new grades to its portfolio of Superflow ULTEM™ resins, to help address this trend.

Glass fiber-reinforced Superflow ULTEM SF2250EPR and SF2270 resins, feature exceptional flow properties for moulding burn-in test sockets (BiTS) used to stress-test integrated circuit chips. They can also potentially be used to mould thin-wall, high-precision, miniaturized connectors.

Their flow properties help meet the challenges of complete mould filling and easy release in ever-smaller, lighter and more-sophisticated components with lower melt temperature settings, that can save energy and allow higher productivity.

Balancing flow with toughness, these resins can potentially replace high-flow, glass fiber-reinforced PES materials. Not only do the ULTEM grades offer similar flow behavior compared to PES – avoiding the need for tool modification – they can deliver up to 20 percent higher strength and modulus, up to 9 percent lower density and lower moisture absorption.

“As electronic components such as IC chips and onboard connectors shrink in size and weight to support new generations of mobile and wearable devices, there is a need for novel materials offering optimized performance and consistent quality in miniaturized configurations,” said Tsutomu (Tom) Kinoshita, senior business manager, SABIC. “These requirements apply both to connectors and burn-in test sockets used to test the performance and reliability of IC chips for higher-speed and higher-density interconnections required by smart electronics. The expansion of our Superflow ULTEM resin portfolio addresses evolving industry trends and demonstrates SABIC’s continued investment in new technologies for the electronics industry.”

Burn-in test socket manufacturers are constantly seeking new material solutions that can support advanced designs for fine-pitch components that are used under extremely harsh conditions, including high temperatures, high pressures and multiple cycles of use.

South Korea’s Sensata Technologies is one of the first BiTS makers to adopt SABIC’s Superflow ULTEM SF2250EPR resin.

Tommy Oh, design & engineering manager, Sensing Solutions, for Sensata Korea, said, “As the industry advances to finer pitches and miniaturization, existing material solutions present technical limitations in complex BiTS designs due to insufficient flowability and weak weld lines. SABIC’s new Superflow ULTEM SF2250EPR solution enables us to successfully develop and commercialize various BiTS devices with superior performance, especially those with lower pitches, such as 0.5 mm and even 0.4 mm. This material has demonstrated approximately 30 percent better ductility, plus much better flowability, compared to alternative PES solutions, especially in thinner-wall weld areas. With the new SABIC material, we anticipate major benefits for our BiTS applications in critical performance areas, including tensile and flexural strength.”

Overcoming the technical limitations of ever smaller components to produce better performance and quality at a smaller size, will allow wearable technology to be able to continue its advancement, helping improve our everyday lives with smaller more integrated tech.