معلومات عامة
Description
The product family of THERMOCOMP™ AM compounds for pellet-fed additive manufacturing is based on amorphous resins such as ABS, PPE, PC and PEI. The compounds exhibit good creep behavior versus semi-crystalline resins, and reduced deformation under constant pressure. Further, lower shrinkage during cooling means these materials demonstrate greater dimensional stability and less thermal expansion during part use.