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主页 > 行业 > 电子电器 > 无线解决方案

无线解决方案

无论是针对智能电话上的内部天线还是基站天线内的精密移相器,沙特基础工业公司拥有精心设计的材料,可以实现强大的无线性能并同时节约空间(尤其对于移动电话来说特别重要),或者满足宽带网络的通信需求。

THERMOCOMP™激光直接成型(LDS)化合物被设计为与乐普科光电有限公司(LPKF)的激光直接成型工艺兼容,从而可以将天线和电子回路嵌入电话外壳表面。THERMOCOMP™ ZKC化合物提供自定义可调介电常数(Dk)和持续偏低的介电损耗(Df),从而让基站天线内的移相器响应不断变化的范围和信号强度需求(基于网络通信量)。

性能考虑因素:

  • 自定义可调介电常数和持续偏低的介电损耗性能
  • 抵抗极端温度的能力
  • 与乐普科光电有限公司的激光直接成型工艺兼容

潜在应用:

  • 移动电话内的内部天线
  • 3D-MID应用
  • 基站天线内的移相器

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